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Results 1 to 25 of 293

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Evaluation of residual stresses in thin films by critical buckling observation of circular microstructures and finite element methodYU, Yi-Ting; YUAN, Wei-Zheng; QIAO, Da-Yong et al.Thin solid films. 2008, Vol 516, Num 12, pp 4070-4075, issn 0040-6090, 6 p.Article

Dissipation in single crystal diamond micromechanical annular plate resonatorsRAY, Matthew P; FEYGELSON, Tatyana I; BUTLER, James E et al.Diamond and related materials. 2011, Vol 20, Num 8, pp 1204-1207, issn 0925-9635, 4 p.Article

Use of a sacrificial layer for an efficient EISA synthesis of mesoporous carbonWILSON, Benjamin E; RUDISILL, Stephen G; STEIN, Andreas et al.Microporous and mesoporous materials. 2014, Vol 197, pp 174-179, issn 1387-1811, 6 p.Article

Pressure sensor based on a microstructure with dual silicon nitride vibrating beamsDEYONG CHEN; DAFU CUI; LI WANG et al.SPIE proceedings series. 2002, pp 287-295, isbn 0-8194-4730-7, 9 p.Conference Paper

Conductive diamond probes with electroplated holder chipsKÖLLING, Sebastian; HANTSCHEL, Thomas; VANDERVORST, Wilfried et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 1178-1181, issn 0167-9317, 4 p.Conference Paper

Perforated polymer membranes fabricated by nanoimprintSCHIFT, Helmut; BELLINI, Sandro; GOBRECHT, Jens et al.Microelectronic engineering. 2006, Vol 83, Num 4-9, pp 873-875, issn 0167-9317, 3 p.Conference Paper

Reduction of thermal oxide desorption etching on gallium arsenidePUN, A. F; WANG, X; DURBIN, S. M et al.Thin solid films. 2007, Vol 515, Num 10, pp 4419-4422, issn 0040-6090, 4 p.Conference Paper

New Sacrificial Layer-Based Screen-Printing Process for Free-Standing Thick-Films Applied to MEMSLUCAT, Claude; GINET, Patrick; MENIL, Francis et al.Journal of microelectronics and electronic packaging. 2007, Vol 4, Num 3, pp 86-92, issn 1551-4897, 7 p.Conference Paper

Novel Approaches to Realizing Chemical Lift-off of GaN Epilayer from Sapphire SubstrateHORNG, Ray-Hua; TSAI, Tsung-Yen; YEN, Cheng-Ying et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7954, issn 0277-786X, isbn 978-0-8194-8491-8, 795417.1-795417.8Conference Paper

Self-sacrificial surface micromachining using poly(methyl methacrylate)JOHNSTONE, R. W; FOULDS, I. G; PARAMESWARAN, M et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 11, issn 0960-1317, 115012.1-115012.7Article

Plasma and chemical treatments of polyimide sacrificial layers in processing of microbolometrsBABAEVSKY, Petr G; ZHUKOV, Andrey A; ZHUKOVA, Svetlana A et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 282-288, issn 0277-786X, isbn 0-8194-5828-7, 1Vol, 7 p.Conference Paper

Advanced sacrificial poly-Si technology for fluidic systemsBERENSCHOT, J. W; TAS, N. R; LAMMERINK, T. S. J et al.Journal of micromechanics and microengineering (Print). 2002, Vol 12, Num 5, pp 621-624, issn 0960-1317Article

A new process technique for complementary metal-oxide-semiconductor [CMOS] compatible sensorsSHEEN, Chin-Shown; SIEN CHI.Sensors and materials. 2001, Vol 13, Num 1, pp 57-66, issn 0914-4935Article

Fabrication of suspended electrokinetic microchannels from directly written sacrificial polymer fibersBERRY, Scott M; ROUSSEL, Thomas J; CAMBRON, Scott D et al.Microfluidics and nanofluidics (Print). 2012, Vol 13, Num 3, pp 451-459, issn 1613-4982, 9 p.Article

Half-coaxial-like transmission line using benzo cyclo butene layerKIM, J.-M; CHEON, C; KWON, Y et al.Electronics Letters. 2008, Vol 44, Num 13, pp 810-811, issn 0013-5194, 2 p.Article

Flash release : An alternative for releasing complex MEMS devicesDELADI, S; SVETOVOY, V; KRIJNEN, G. J. M et al.Symposium on Design, Test, Integration and Packaging of MWMS/MOEMS. 2004, pp 343-348, isbn 2-84813-026-1, 6 p.Conference Paper

Smoothing and surface planarization of sacrificial layers in MEMS technologyLUCIBELLO, Andrea; PROIETTI, Emanuela; MARCELLI, Romolo et al.Microsystem technologies. 2013, Vol 19, Num 6, pp 845-851, issn 0946-7076, 7 p.Conference Paper

Fabrication of microchannels using polynorbornene photosensitive sacrificial materialsXIAOQUN WU; REED, Hollie A; YONG WANG et al.Journal of the Electrochemical Society. 2003, Vol 150, Num 9, pp H205-H213, issn 0013-4651Article

SU8-micromechanical structures with in situ fabricated movable partsSEIDEMANN, V; RABE, J; FELDMANN, M et al.Microsystem technologies. 2002, Vol 8, Num 4-5, pp 348-350, issn 0946-7076Conference Paper

A new process to fabricate the electromagnetic stepping micromotor using LIGA process and surface sacrificial layer technologyYI, F; PENG, L; ZHANG, J et al.Microsystem technologies. 2001, Vol 7, Num 3, pp 103-106, issn 0946-7076Article

Generation of cavities in silicon wafers by laser ablation using silicon nitride as sacrificial layerLERNER, B; PEREZ, M. S; TORO, C et al.Applied surface science. 2012, Vol 258, Num 7, pp 2914-2919, issn 0169-4332, 6 p.Article

Fabrication of nanoscale metallic air-bridges by introducing a SiO2 sacrificial layerYANG ZHANG; JIAN LIU; YAN LI et al.Materials science in semiconductor processing. 2007, Vol 10, Num 4-5, pp 194-199, issn 1369-8001, 6 p.Article

Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics : Critical processes and reliability of Air Gap formationSCHULZE, K; SCHULZ, S. E; GESSNER, T et al.Microelectronic engineering. 2007, Vol 84, Num 11, pp 2587-2594, issn 0167-9317, 8 p.Conference Paper

Roughness improvement of the CoSi2/Si-interface for an application as buried silicideZIMMERMANN, S; ZHAO, Q. T; HÖHNEMANN, H et al.Microelectronic engineering. 2007, Vol 84, Num 11, pp 2537-2541, issn 0167-9317, 5 p.Conference Paper

Air gap type thin film bulk acoustic resonator fabrication using simplified processEUNG KWON KIM; TAE YONG LEE; YOUNG HAK JEONG et al.Thin solid films. 2006, Vol 496, Num 2, pp 653-657, issn 0040-6090, 5 p.Article

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